Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas | 東京工業大学附属図書館資料名データベース

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Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

責任表示:: sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read
シリーズ名:: ASME Symposia Volumes
シリーズ巻号:: AMD 222 ; EEP 20
出版情報:: New York, NY: American Society of Mechanical Engineers, 1997
ISBN:: 9780791818275 [0791818276]
請求記号:: A11615/222
資料種別:: 国際会議録

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詳細

TDL書誌ID:	ZA00063434
シリーズＩＤ:	PA00000270
会議名:	ASME International Mechanical Engineering Congress and Exposition
回次:	1997
会議開催地:	Dallas, TX, USA
会議開催年:	1997.11.16-1997.11.21

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