Mechanics and materials for electronic packaging : volume 1. design and process issues in electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 | 東京科学大学図書館資料名データベース

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Mechanics and materials for electronic packaging : volume 1. design and process issues in electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

責任表示:: co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et
シリーズ名:: ASME Symposia Volumes
シリーズ巻号:: AMD 195
出版情報:: New York, NY: American Society of Mechanical Engineers, 1994
ISBN:: 9780791814499 [0791814491]
請求記号:: A11615/942720
資料種別:: 国際会議録

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詳細

TDL書誌ID:	ZA00063411
シリーズＩＤ:	PA00000270
会議名:	ASME International Mechanical Engineering Congress and Exposition
回次:	1994
会議開催地:	Chicago, IL, USA
会議開催年:	1994.11.06-1994.11.11

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