Mechanics and materials for electronic packaging : volume 3. coupled field behavior in materials : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
- 責任表示:
- co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.L. Dunn ... [et al.]
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- AMD 193
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1994
- ISBN:
- 9780791814420 [0791814424]
- 請求記号:
- A11615/942718
- 資料種別:
- 国際会議録
類似資料:
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
