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Mechanics and materials for electronic packaging : volume 3. coupled field behavior in materials : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

責任表示:
co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.L. Dunn ... [et al.]
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
AMD 193
出版情報:
New York, NY: American Society of Mechanical Engineers, 1994
ISBN:
9780791814420 [0791814424]
請求記号:
A11615/942718
資料種別:
国際会議録
巻号一覧
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