Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991
- 責任表示:
- sponsored by the Applied Mechanics Division, ASME, the Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- AMD 131 ; EEP 1
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1991
- ISBN:
- 9780791808962 [0791808963]
- 請求記号:
- A11615/920682
- 資料種別:
- 国際会議録
類似資料:
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |