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Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

責任表示:
sponsored by the Applied Mechanics Division, ASME, the Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
AMD 131 ; EEP 1
出版情報:
New York, NY: American Society of Mechanical Engineers, 1991
ISBN:
9780791808962 [0791808963]
請求記号:
A11615/920682
資料種別:
国際会議録
巻号一覧
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