Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA | 東京工業大学附属図書館資料名データベース

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Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge, Massachusetts, USA

責任表示:: sponsored by the Electronic Materials and Processing Division of ASM International
シリーズ名:: ASM International Conference Proceedings
出版情報:: Materials Park, OH: ASM International, 1992
ISBN:: 9780871704498 [0871704498]
請求記号:: A11370/931486
資料種別:: 国際会議録

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詳細

TDL書誌ID:	ZA00062748
シリーズＩＤ:	PA00000267
会議名:	Electronic Materials and Processing Congress
回次:	7th
会議開催地:	Cambridge, MA, USA
会議開催年:	1992.08.24-1992.08.27

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