Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress | 東京工業大学附属図書館資料名データベース

Blank Cover Image

Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress

責任表示:: sponsored by the Electronic Materials and Processing Division of ASM International ; edited by Prabjit Singh
シリーズ名:: ASM International Conference Proceedings
出版情報:: Materials Park, OH: ASM International, 1991
ISBN:: 9780871704351 [0871704358]
請求記号:: A11370/931495
資料種別:: 国際会議録

巻号一覧

Loading volume number list

詳細

TDL書誌ID:	ZA00062745
シリーズＩＤ:	PA00000267
会議名:	Electronic Materials and Processing Congress
回次:	4th
会議開催地:	Montreal, QC, Canada
会議開催年:	1991.08.19-1991.08.22

類似資料:

1 国際会議録 Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing … ASM International	7 国際会議録 Microelectronic Yield, Reliability, and Advanced Packaging SPIE-The International Society for Optical Engineering
2 国際会議録 Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin … Electrochemical Society	8 国際会議録 Electronic packaging : materials and processes : proceedings of ASM's 2nd Electronic Packaging: Materials and Processes Conference, Bloomington, Minnesota, … ASM International
3 国際会議録 Corrosion and reliability of electronic materials and devices : proceedings of the fourth international symposium Electrochemical Society	9 国際会議録 Microelectronic Packaging and Laser Processing SPIE-The International Society for Optical Engineering
4 国際会議録 Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International … American Society of Mechanical Engineers	10 国際会議録 Materials in microelectronic and optoelectronic packaging American Ceramic Society
5 国際会議録 New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, … ASM International	11 国際会議録 Proceedings of the Second International Symposium on Corrosion and Reliability of Electronic Materials and Devices Electrochemical Society
6 国際会議録 Mechanics and materials for electronic packaging : volume 1. design and process issues in electronic packaging : presented at 1994 International Mechanical … American Society of Mechanical Engineers	12 国際会議録 Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12