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New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990

責任表示:
edited by B.R. Livesay and M.D. Nagarkar ; sponsored by the Electronic Materials and Processing Division of ASM International
シリーズ名:
ASM International Conference Proceedings
出版情報:
Materials Park, OH: ASM International, 1990
ISBN:
9780871703965 [0871703963]
請求記号:
A11370/931499
資料種別:
国際会議録
巻号一覧
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