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Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics, at 214th ECS Meeting, October 12-17, 2008, Honolulu, Hawaii, USA

責任表示:
Structures, and Low-k Inter-level Dielectrics, at 214th ECS Meeting, October 12-17, 2008, Honolulu, Hawaii, USA
シリーズ名:
ECS transactions
シリーズ巻号:
16(19)
出版情報:
Pennington, NJ: Electrochemical Society, 2009
ISSN:
19385862
ISBN:
9781615672936 [1615672931]
請求記号:
E23400/16-17 [19]
資料種別:
国際会議録
巻号一覧
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