Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
- 責任表示:
- structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
- シリーズ名:
- ECS transactions
- シリーズ巻号:
- 1(11)
- 出版情報:
- Pennington, NJ: Electrochemical Society, 2006
- ISSN:
- 19385862
- ISBN:
- 9781566774994 [1566774993]
- 請求記号:
- E23400/1-11
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society | |
Electrochemical Society |