Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA | 東京工業大学附属図書館資料名データベース

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Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA

責任表示:: structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
シリーズ名:: ECS transactions
シリーズ巻号:: 1(11)
出版情報:: Pennington, NJ: Electrochemical Society, 2006
ISSN:: 19385862
ISBN:: 9781566774994 [1566774993]
請求記号:: E23400/1-11
資料種別:: 国際会議録

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詳細

TDL書誌ID:	ZA00047105
シリーズＩＤ:	PA00000034
会議名:	ECS meeting
回次:	208th
会議開催地:	Los Angeles, California, USA
会議開催年:	2005.10.16-2005.10.21

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