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Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

責任表示:
editors, Ting Y. Tsui ... [et al.]
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
914
出版情報:
Warrendale, Pa.: Materials Research Society, 2006
ISSN:
02729172
ISBN:
9781558998705 [1558998705]
請求記号:
M23500/914
資料種別:
国際会議録
巻号一覧
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