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Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

責任表示:
editor, G.S. Mathad ; assistant editors, T. S. Cale ...[et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2003-13
出版情報:
Pennington, N.J.: Electrochemical Society, 2003
ISSN:
01616374
ISBN:
9781566773935 [1566773938]
請求記号:
E23400/200313
資料種別:
国際会議録
巻号一覧
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