Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium | 東京工業大学附属図書館資料名データベース

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Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium

責任表示:: Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
シリーズ名:: Electrochemical Society Proceedings Series
シリーズ巻号:: 2003-10
出版情報:: Pennington, N.J.: Electrochemical Society, 2001
ISSN:: 01616374
ISBN:: 9781566772945 [156677294X]
請求記号:: E23400/200310
資料種別:: 国際会議録

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詳細

TDL書誌ID:	ZA00014074
シリーズＩＤ:	PA00000028
会議名:	Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ; Meeting of the Electrochemical Society
回次:	2000 ; 198th
会議開催地:	Phoenix, AZ, USA
会議開催年:	2000.10.22-2000.10.27

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