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Proceedings : 2003 IMAPS Conference and Exhibition on Ceramic Interconnect Technology : The Next Generation : April 7-9, 2003, The Westin Hotel, Denver, Colorado

責任表示:
sponsored by International Microelectronics And Packaging Society (IMAPS), Ceramic Interconnect Initiative ; endosed by The American Ceramic Society (ACerS)
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
5231
出版情報:
Washington, DC: IMAPS, 2003
ISSN:
0277786X
ISBN:
9780819451057 [0819451053]
請求記号:
P63600/5231
資料種別:
国際会議録
巻号一覧
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