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Materials in microelectronic and optoelectronic packaging

責任表示:
edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla
シリーズ名:
Ceramic transactions
シリーズ巻号:
33
出版情報:
Westerville, Ohio: American Ceramic Society, 1993
ISBN:
9780944904633 [0944904637]
請求記号:
C24320/931698
資料種別:
国際会議録
巻号一覧
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類似資料:

1 国際会議録 Optoelectronic Packaging

SPIE-The International Society for Optical Engineering
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2 国際会議録 Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress

ASM International
8 国際会議録 Optoelectronic Interconnects and Packaging IV

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3 国際会議録 Microelectronic Packaging and Laser Processing

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9 国際会議録 Optoelectronic Integrated Circuits and Packaging V

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4 国際会議録 Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical …

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10 国際会議録 Microelectronic interconnects and packages, optical and electrical technologies

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5 国際会議録 Microelectronic Yield, Reliability, and Advanced Packaging

SPIE-The International Society for Optical Engineering
11 国際会議録 Microelectronic interconnects and packages, system and process integration

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6 国際会議録 Optoelectronic materials, devices, packaging, and interconnects : 19-21 August 1987, San Diego, California

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12 国際会議録 Laser Applications in Microelectronic and Optoelectronic Manufacturing II

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