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Process-Induced Voiding in Copper Interconnect Metallization

著者名:
Lindgren, P.
Downes, K.
Kole, S.
Murphy, W.
Cooney, E., III
Goldstein, M.
Chapple-Sokol, J.
さらに 2 件
掲載資料名:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2003-10
発行年:
2003
開始ページ:
237
終了ページ:
243
総ページ数:
7
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
言語:
英語
請求記号:
E23400/200310
資料種別:
国際会議録

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