Process-Induced Voiding in Copper Interconnect Metallization
- 著者名:
Lindgren, P. Downes, K. Kole, S. Murphy, W. Cooney, E., III Goldstein, M. Chapple-Sokol, J. - 掲載資料名:
- Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2003-10
- 発行年:
- 2003
- 開始ページ:
- 237
- 終了ページ:
- 243
- 総ページ数:
- 7
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772945 [156677294X]
- 言語:
- 英語
- 請求記号:
- E23400/200310
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
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Materials Research Society |
10
国際会議録
Effects of local crystallography on stress-induced voiding in passivated copper interconnects.
Kluwer Academic Publishers |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
MRS - Materials Research Society |