Kinetics of Void Drift in Copper Interconnects

Kinetics of Void Drift in Copper Interconnects

著者名:

掲載資料名:

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

914

発行年:

2006

開始ページ:

369

終了ページ:

368

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558998705 [1558998705]

言語:

英語

請求記号:

M23500/914

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015794
シリーズID:	PA00000011
会議名:	Symposium on materials, technology and reliability of low-k dielectrics and copper interconnects
回次:	2006
会議開催地:	San Francisco, CA, USA
会議開催年:	2006.04.18-2006.04.21

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