Vijayakumar, A. ; Du, T. ; Sundaram, K.B. ; Desai, V.
出版情報:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.164-173, 2003. Pennington, N.J.. Electrochemical Society
flu, T ; Desai, V. ; Ta, D. ; Cliathapuram, nboli; V. ; Sundaram, K.B.
出版情報:
Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium. pp.235-245, 2002. Pennington, N.J.. Electrochemical Society
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