1.

国際会議録
国際会議録
1. Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
S.H. Lee ; J.H. Lee ; J.W. Lee ; J.M. Kim
出版情報: Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea.  pp.213-216,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 580-582
2.

国際会議録
国際会議録
2. Plasma Etching for the Application to Low-K Dielectrics Devices
J.W. Lee ; H.W. Kim ; J.W. Han ; M.S. Kim ; B.D. Yoo ; M.H. Kim ; C.H. Lee ; C.H. Lim ; S.K. Hwang ; C. Lee ; D.J. Chung ; S.G. Park ; S.G. Lee ; B.H. O ; J. Kim ; S.P. Chang ; S.H. Lee ; S.Y. Chai ; W.I. Lee ; S.E. Park ; K. Kim ; D.K. Choi ; C.W. Chung
出版情報: Research trends in contemporary materials science : YUCOMAT VIII : selected papers presented at the 8th Conference of the Yugoslav Materials Research Society, held in Herceg Novi, Montenegro September 4-8, 2006.  pp.113-118,  2007.  Stafa-Zuerich, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 555