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Advanced RELACS (resolution enhancment of lithography by assist of chemical shrink) material for 193-nm lithography

著者名:
Hong, S. ( Clariant Japan K.K. (Japan) )
Takano, Y. ( Clariant Japan K.K. (Japan) )
Kanda, T. ( IMEC (Belgium) )
Kudo, T. ( Clariant Corp. (USA) )
Padmanaban, M. ( Clariant Corp. (USA) )
Tanaka, H. ( Clariant Japan K.K. (Japan) )
Lee, S.-H. ( Samsung Electronics Co., Ltd. (South Korea) )
Lee, J.-H. ( Samsung Electronics Co., Ltd. (South Korea) )
Woo, S.-G. ( Samsung Electronics Co., Ltd. (South Korea) )
さらに 4 件
掲載資料名:
Advances in Resist Technology and Processing XX
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
5039
発行年:
2003
巻:
1
パート:
Session 5
開始ページ:
195
終了ページ:
206
総ページ数:
12
出版情報:
Bellingham, CA: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819448446 [0819448443]
言語:
英語
請求記号:
P63600/5039
資料種別:
国際会議録

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