Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS

Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS

著者名:

Hong, S. ( Univ. of Southern California (USA) )
Ho, T. ( Univ. of Southern California (USA) )
Zhang, L. ( Univ. of Southern California (USA) )
Sawchuk, A.A. ( Univ. of Southern California (USA) )

掲載資料名:

Photonics Packaging and Integration III

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

4997

発行年:

2003

開始ページ:

127

終了ページ:

134

総ページ数:

8

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819447975 [0819447978]

言語:

英語

請求記号:

P63600/4997

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00012980
シリーズID:	PA00000029
会議名:	Photonics West - Optoelectronic Materials and Devices : Photonics packaging and integration
回次:	2003 : 3rd
会議開催地:	San Jose, CA, USA
会議開催年:	2003.01.28-2003.01.30

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