MATERIALS AND STRUCTURES FOR HIGH DENSITY I/O INTERCONNECTION SYSTEMS

MATERIALS AND STRUCTURES FOR HIGH DENSITY I/O INTERCONNECTION SYSTEMS

著者名:

掲載資料名:

Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

108

発行年:

1988

開始ページ:

309

終了ページ:

318

総ページ数:

10

出版情報:

Pittsburgh, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9780931837760 [0931837766]

言語:

英語

請求記号:

M23500/108

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015594
シリーズID:	PA00000011
会議名:	Symposium on electronic packaging materials science
回次:	3rd
会議開催地:	Boston, MA, USA
会議開催年:	1987.11.30-1987.12.04

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