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The Effects of Test Condition, Microstructure and Linewidth on Electromigration Void Morphology

著者名:
Bauguess, S.
Dreyer, M. L.
Tucker, M.
Theodore, D.
Lee, C. T.
Edwards, S.
さらに 1 件
掲載資料名:
Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
391
発行年:
1995
開始ページ:
379
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992948 [1558992944]
言語:
英語
請求記号:
M23500/391
資料種別:
国際会議録

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