Blank Cover Image

Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing

著者名:
掲載資料名:
Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
867
発行年:
2005
開始ページ:
69
終了ページ:
74
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998209 [1558998209]
言語:
英語
請求記号:
M23500/867
資料種別:
国際会議録

類似資料:

1 国際会議録 Characterization of the Chemical Interactions on Copper Chemical Mechanical Polishing

Lee, S.-M., Abiade, J., Choi, W., Singh, R.

Electrochemical Society
7 国際会議録 Chemical-Mechanical Polishing of Copper in Glycerol Based Slurries

Kumar, K. S., Murarka, S. P.

MRS - Materials Research Society
2 国際会議録 Investigation and Control of Chemical and Surface Chemical Effects During Dielectric CMP

Abiade, J.T., Choi, W., Khosla, V., Singh, R.K.

Materials Research Society
8 国際会議録 Hydrodynamics of a Chemical-Mechanical Planarization Process

Moudgil, B., Park, C-W., Singh, R., Sohn, I. S.

Materials Research Society
3 国際会議録 Surface-Particle Interactions in the Chemical Mechanical Polishing Process

Adler, J. J., Rabinovich, Y. I., Singh, R. K., Moudgil, B. M.

MRS - Materials Research Society
9 国際会議録 The Chemical-Mechanical Polishing of Copper with Model Slurries

Lee, B-C., Duquette, D.J., Gutmann, R.J.

Electrochemical Society
4 国際会議録 Developing Engineered Particulate Systems for Oxide Chemical Mechanical Polishing

Basim, G.B., Adler, J.J., Mahajan, U., Singh, R.K., Moudgil, B.M.

Electrochemical Society
10 国際会議録 CHEMICAL-MECHANICAL POLISHING OF TUNGSTEN WITH HOLOGEN-BASED SLURRIES

Yang, K., Gutmann, R. J., Murarka, S. P., Stonebaker, E., Atkins, H.

MRS - Materials Research Society
5 国際会議録 Modeling of Polishing Regimes in Chemical Mechanical Polishing

Yeruva, Suresh B., Park, Chang-Won, Moudgil, Brij M.

Materials Research Society
11 国際会議録 A Quantitative Model for Oxide Erosion in Chemical Mechanical Polishing of Tungsten

Yoon, B.U., Jeong, I.K, Kim, J.Y., Lee, J.W., Hah, S.R., Moon, J.T., Lee, S.I.

Electrochemical Society
6 国際会議録 Optimal Size Distribution of CMP Slurries for Enhanced Polishing with Minimal Defects

Basim, G.B., Adler, J.J., Mahajan, U., Singh, R.K., Moudgil, B.M.

Electrochemical Society
12 国際会議録 Characterization Of Circulated Chemical-Mechanical Polishing Slurry Particles Using Two Analysis Methods

Litchy, Mark R., Nicholes, Kristi, Grant, Donald C., Singh, Rakesh K.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12