1.

国際会議録
国際会議録
1. Interfacial Wettability and Thermal Conductivity of Diamond/Al Based Composites with Ti and B Additions
S.X. Li ; H. Guo ; Y.M. Fan ; Y.Y. Han ; X.M. Zhang
出版情報: High Performance Structural Material : Selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China.  pp.169-176,  2015.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 816
2.

国際会議録
国際会議録
2. Thermal Analysis of High Power Light Emitting Diodes Package
Y.Y. Han ; H. Guo ; X.M. Zhang ; F.Z. Yin ; K. Chu
出版情報: Functional and electronic materials : selected, peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China.  pp.215-221,  2011.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 687
3.

国際会議録
国際会議録
3. Finite Element Analysis of the Effect of Particle Shape on the Thermal Conductivity in Diamond/Cu Composites
H. Guo ; Y.Y. Han ; X.M. Zhang ; F.Z. Yin ; Y.M. Fan
出版情報: Structural Materials : Selected, peer reviewed papers from the 12th IUMRS International Conference on Advanced Materials (IUMRS-ICAM 2013), September 22 -28, 2013, Qingdao, China.  pp.689-692,  2014.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 788