1.

国際会議録
国際会議録
1. Surface Morphology and Discharge Channel Temperature Estimation of PEO Ceramic Coatings on Aluminum
D.J. Shen ; W.C. Gu ; Y.L. Wang ; G.Z. Xing ; P. Nash
出版情報: Aluminium materials : Progress in light metals, aerospace materials and superconductors . 2006 BIMW : 2006 Beijing International Materials Week, June 25-30, 2006, Beijing, China.  546-549  pp.1135-1140,  2007.  Uetikon-Zuerich, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 546-549(2)
2.

国際会議録
国際会議録
2. Influence of Ru and Cr on the Heat-Treated Microstructure of Ni-Based Superalloys
W.B. Wang ; Q. Feng ; L.J. Carroll ; Y.L. Wang ; G.L. Chen ; T.M. Pollock
出版情報: Aerospace materials : Progress in light metals, aerospace materials and superconductors . 2006 BIMW : 2006 Beijing International Materials Week, June 25-30, 2006, Beijing, China.  546-549  pp.1207-1210,  2007.  Uetikon-Zuerich, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 546-549(3)
3.

国際会議録
国際会議録
3. Synthesis of Carbon Nanotube-Reinforced Al Matrix Composites
J.H. Ahn ; Y.L. Wang ; Y.J. Kim ; S.J. Kim ; H.S. Chung
出版情報: THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canad.  539-543  pp.860-865,  2007.  Stafa-Zuerich.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 539-543(1)
4.

国際会議録
国際会議録
4. The Preparation of Pure and Phosphrous-Doped La2Mo2O9 Oxide Ion Conductor by a Modified Precipitation Method
Q. Li ; F.Y. Dai ; L.W. Zhang ; L.G. Jin ; Y.L. Wang
出版情報: Functional Materials Research : selected, peer reviewed papers from the China Functional Material Technology and Industry Forum CFMTIF 2015, October 30th - Novemnber 1th, 2015.  pp.963-968,  2016.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 852
5.

国際会議録
国際会議録
5. Analysis of Factors Influencing CPU Heat Dissipation of Porous Magnesium
L.C. Wang ; Y.L. Wang ; C.X. Wang
出版情報: High Performance Structure Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China.  pp.463-469,  2013.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 747-748
6.

国際会議録
国際会議録
6. Preparation and Characterization of MnOX-CeO2/TiO2 Catalytic Material for SCR of NOX with NH3 at Low Temperature
Q.D. Liu ; S.P. Cui ; H.X. Guo ; Y.L. Wang ; Y.F. Zhang
出版情報: Energy and Environment Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China.  pp.198-203,  2013.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 743-744
7.

国際会議録
国際会議録
7. Using Calcium Carbide Slag as One of Calcium-Containing Raw Materials to Produce Cement Clinker
Y.L. Wang ; S.J. Dong ; L.L. Liu ; S.P. Cui
出版情報: Energy and Environment Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China.  pp.171-174,  2013.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 743-744
8.

国際会議録
国際会議録
8. The Morphology and Evolution of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging
Y.L. Wang ; K.K. Zhang ; C.Y. Li ; L.J. Han
出版情報: Physical and Numerical Simulation of Material Processing VI : Selected, peer reviewed papers from the 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010), November 16-19, 2010, Guilin, China.  pp.685-689,  2012.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 704-705
9.

国際会議録
国際会議録
9. Microstructure and Properties of T2 Copper Tube Produced by Severe Hot Rolling
Y.L. Wang ; Y. Liu ; J.T. Wang ; F.S. Tian
出版情報: Nanomaterials by severe plastic deformation : NANOSPD5 : selected peer-reviewed papers from the 5th International Conference on Nanomaterials by Severe Plastic Deformation held in Nanjing, China on March 21-25, 2011.  pp.193-198,  2011.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 667-669
10.

国際会議録
国際会議録
10. Effect of RE on Creep Rupture Life of SnAgCu Solder Joints
Y.L. Wang ; G.H. Dong ; C.Y. Li ; Z.W. Wu ; J. Sun
出版情報: Functional and electronic materials : selected, peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China.  pp.39-43,  2011.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 687