The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP

The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP

著者名:

Song, Jae-Hoon

掲載資料名:

Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

867

発行年:

2005

開始ページ:

35

終了ページ:

40

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558998209 [1558998209]

言語:

英語

請求記号:

M23500/867

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014510
シリーズID:	PA00000011
会議名:	MRS Spring Meeting
回次:	2005
会議開催地:	San Francisco, California, U.S.A.
会議開催年:	2005.03.28-2005.03.31

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2 国際会議録 The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry Kang, Young-Jae, Hong, Yi-Koan, Song, Jae-Hoon, Kim, In-Kwon, Park, Jin-Goo Materials Research Society	8 国際会議録 The Formation of Water Marks on Both Hydrophilic and Hydrophobic Wafers Park, Jin-Goo, Han, Jeung-Hoon, Kim, Seung-Hwan, Lee, Sang-Ho MRS - Materials Research Society
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