1.

国際会議録
国際会議録
1. CVD Cu Process Development and Integration for Sub-0.18 ｦﾌm Devices
Zhang, J. ; Denning, D. ; Braeckelmann, G. ; Hamilton, G. ; Lee, J. J. ; Venkatraman, R. ; Fiordalice, B. ; Weitzman, E.
出版情報: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.243-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 564
2.

国際会議録
国際会議録
2. Advanced CVD Barrier Technology for Copper Interconnect
Jain, A. ; Adetutu, O. ; Ekstrom, B. ; Hamilton, G. ; Herrick, M. ; Venkatraman, R. ; Weitzman, E.
出版情報: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.269-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 564
3.

国際会議録
国際会議録
3. Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology
Venkatraman, R. ; Jain, A. ; Farkas, J. ; Mendonca, J. ; Hamilton, G. ; Capasso, C. ; Denning, D. ; Simpson, C. ; Rogers, B. ; Frisa, L. ; Ong, T. P. ; Herrick, M. ; Kaushik, V. ; Gregory, R. ; Apen, E. ; Angyal, M. ; Filipiak, S. ; Crabtree, P. ; Sparks, T. ; Anderson, S.
出版情報: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.41-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 514
4.

国際会議録
国際会議録
4. Designing high-performance cost-efficient embedded SRAM in deep-submicron era
Kobozeva, O. ; Venkatraman, R. ; Castagnetti, R. ; Duan, F. ; Kamath, A. ; Ramesh, S.
出版情報: Design and process integration for microelectronic manufacturing II [sic] : 26-27 February 2004, Santa Clara, California, USA.  pp.241-252,  2004.  Bellingham, Wash., USA.  SPIE - The International Society of Optical Engineering
シリーズ名: Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号: 5379