1.

国際会議録
国際会議録
1. IMPACT OF THE ELECTROCHEMICAL PROPERTIES OF SILICON WAFER SURFACES ON COPPER OUTPLATING FROM HF SOLUTIONS
Teerlinck, I. ; Schmidt, H.F. ; Rotondaro, A.L.P. ; Hurd, T.Q. ; Mouche, L. ; Mertens, P.W. ; Meuris, M. ; Heyns, M.M. ; Vanhaeren, D. ; Vandervorst, W.
出版情報: Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing.  pp.284-291,  1995.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 95-20
2.

国際会議録
国際会議録
2. THE FORMATION AND REMOVAL OF RESIDUE FORMED DURING TiN FLUOROCARBON PLASMA ETCHING
Kim, Y.B. ; Conard, T. ; Vanhaeren, D. ; Baklanov, M. ; Vanhaelemeersch, S. ; Vandervorst, W. ; Maex, K.
出版情報: Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing.  pp.610-616,  1997.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 97-35
3.

国際会議録
国際会議録
3. On Factors Affecting the Extraction of Elastic Modulus by Nanoindentation of Organic Polymer Films
Iacopi, F. ; Laknin, M. ; Mulloy, A. ; den-Toonder, J. M. J. ; Vanhaeren, D. ; Brongersma, S. H.
出版情報: Fundamentals of nanoindentation and nanotribology III : symposium held November 29-December 3, 2004, Boston, Massachusetts, U.S.A..  pp.181-186,  2005.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 841