Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy
- 著者名:
M. K. Keswani H. Lee S. Babu U. Patri Y. Hong L. Economikos M. Goldstein L. Borucki A. Philipossian Y. Zhuang - 掲載資料名:
- Silicon materials science and technology X
- シリーズ名:
- ECS transactions
- シリーズ巻号:
- 2(2)
- 発行年:
- 2006
- 開始ページ:
- 515
- 終了ページ:
- 522
- 総ページ数:
- 8
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566774390 [156677439X]
- 言語:
- 英語
- 請求記号:
- E23400/2-2
- 資料種別:
- 国際会議録
類似資料:
American Institute of Chemical Engineers |
Materials Research Society |
American Institute of Chemical Engineers |
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American Institute of Chemical Engineers |
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6
国際会議録
Experimental Investigation and Numerical Simulation of Pad Stain Formation During Copper CMP
Materials Research Society |
Electrochemical Society |