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Thermal Stresses, Interfacial Reactions, and Microstructures of Al/Ti and Al/TiN Thin Films Encapsulated by SiOF

著者名:
掲載資料名:
Low-dielectric constant materials III : symposium held April 1-4, 1997, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
476
発行年:
1997
開始ページ:
267
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993808 [1558993800]
言語:
英語
請求記号:
M23500/476
資料種別:
国際会議録

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