1.

国際会議録
国際会議録
1. Coopper Oxide Removal By In-situ Plasma Pre-Treatment For Improved Copper To Dielectric Barrier Adhesion
Lim, Y.K. ; Goh, W.L. ; Tse, M.S. ; Tse, T.Y. ; Seet, C.S. ; Lu, W. ; Randall ; Cha, C.L. ; Adebanjo, Ricky ; Steiner, Kurt G.
出版情報: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.55-65,  2001.  Pennington, N.J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 2001-17
2.

国際会議録
国際会議録
2. Characterization and reduction of copper chemical-mechanical-polishing-induced scratches
Teo, T.Y. ; Goh, W.L. ; Leong, L.S. ; Lim, V.S.K. ; Tse, T.Y. ; Chan, L.
出版情報: Process and Materials Characterization and Diagnostics in IC Manufacturing.  pp.61-69,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
シリーズ名: Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号: 5041