Characterization and reduction of copper chemical-mechanical-polishing-induced scratches
- 著者名:
Teo, T.Y. ( Nanyang Technological Univ. (Singapore) ) Goh, W.L. ( Nanyang Technological Univ. (Singapore) ) Leong, L.S. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) ) Lim, V.S.K. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) ) Tse, T.Y. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) ) Chan, L. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) ) - 掲載資料名:
- Process and Materials Characterization and Diagnostics in IC Manufacturing
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 5041
- 発行年:
- 2003
- 開始ページ:
- 61
- 終了ページ:
- 69
- 総ページ数:
- 9
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819448460 [081944846X]
- 言語:
- 英語
- 請求記号:
- P63600/5041
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
MRS - Materials Research Society |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
MRS - Materials Research Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
12
国際会議録
Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing
Materials Research Society |