Numerical and Experimental Simulation of Electro-Thermal Behavior of VLSI Chips
- 著者名:
Delalic, Z.J. ( Temple University ) Cohen, R. Chen, J. Silage, D. Lin, J. Kaku, V. Modi, D. Moussaoui, C. - 掲載資料名:
- Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 4587
- 発行年:
- 2001
- 開始ページ:
- 218
- 終了ページ:
- 223
- 総ページ数:
- 6
- 出版情報:
- Washington, DC: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815646 [0930815645]
- 言語:
- 英語
- 請求記号:
- P63600/4587
- 資料種別:
- 国際会議録
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