1.

国際会議録
国際会議録
1. FULL THREE DIMENSIONAL MICROCIRCUIT INTEGRATION TECHNIQUES USING WAFER BONDING
D.B. Booth ; C.B. Hunt ; S. Mani ; S. Glenn
出版情報: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.293-302,  1993.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 1993-29
2.

国際会議録
国際会議録
2. Final optics damage inspection (FODI) for the National Ignition Facility
A. Conder ; T. Alger ; S. Azevedo ; J. Chang ; S. Glenn
出版情報: Laser-induced damage in optical materials : 2007 : 39th Annual Boulder Damage Symposium : proceedings : 24-26 September, 2007, Boulder, Colorado.  pp.672010-1-672010-15,  2007.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
シリーズ名: Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号: 6720