1.

国際会議録
国際会議録
1. WATER TRANSPORT ACROSS MODOFIED POLYIMIDE SURFACES: ION-BOMBARDED PMDA-ODA AND BPDA-PDA
Clearfield, H. M. ; Furman, B. K. ; Bailey, F. ; Sheth, N ; Purushothaman, S.
出版情報: Electronic packaging materials science VI : symposium held April 27-30, 1992, San Francisco, California, U.S.A..  pp.237-242,  1992.  Pittsburgh, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 264
2.

国際会議録
国際会議録
2. The Impact of Wafer-Level Layer Transfer on High Perfomance Devices and Circuits for 3D IC Fabrication
Guarini, K.W ; Topol, A.W. ; Jeong, M. ; Bernstein, K. ; Xju, K. ; Joshi, R.V. ; Yu, R. ; Ski, L. ; Newport, M.R. ; Singh, D.V. ; Cohen, G.M. ; Pogge, H.B. ; Purushothaman, S. ; Haensch, W.E.
出版情報: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.390-404,  2003.  Pennington, N.J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 2003-13
3.

国際会議録
国際会議録
3. Issues in Low k Dielectric Integration
Ryan, J.G. ; Hay, J. ; Shaw, T. ; Purushothaman, S. ; Hedrick, J. ; Davis, C. ; McGahay, V. ; Goldblatt, R.
出版情報: ULSI process integration : proceedings of the first international symposium.  pp.323-328,  1999.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 99-18
4.

国際会議録
国際会議録
4. Integration Issues for New Dielectrics in CMOS Technology
Gates, S. ; Chen, S.T. ; Chen, X. ; Cohen, S. ; Edelstein, D. ; Fitzsimmons, J. ; Hedrick, J. ; Restaino, D. ; Ryan, J. ; Simonyi, E. ; Purushothaman, S.
出版情報: Low and high dielectric constant materials : materials science, processing, and reliability issues : proceedings of the fifth international symposium.  pp.31-39,  2000.  Pennington, N.J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 2000-5
5.

国際会議録
国際会議録
5. A NON-DESTRUCTWE TECHNIQUE TO MEASURE THE EXTENT OF INTER-DIFFUSION IN OXIDE SOLID SOLUTION INTERFACES BETWEEN METALS AND CERAMICS
Narayan, C. ; Velosa, A. ; Purushothaman, S. ; Reddy, S. N. S.
出版情報: Interfaces between polymers, metals, and ceramics : symposium held April 25-27, 1989, San Diego, California, U.S.A..  pp.91-96,  1989.  Pittsburgh, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 153
6.

国際会議録
国際会議録
6. Metal-Polyimide Interfaces Characterized by Secondary Ion Mass Spectroscopy
Furman, B. K. ; Purushothaman, S. ; Castellani, E. ; Renick, S. ; Neugroshl, D.
出版情報: Metallization of polymers.  pp.297-,  1990.  Washington, DC.  American Chemical Society
シリーズ名: ACS symposium series
シリーズ巻号: 440
7.

国際会議録
国際会議録
7. Corrosion and Adhesion of Multilayer Pad Structures for Packaging Applications
Frankel, G.S. ; Purushothaman, S. ; Petersen, T. A. ; Farooq, S. ; Reddy, S. N. ; Brusic, V.
出版情報: Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices.  pp.181-191,  1994.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 1994-29
8.

国際会議録
国際会議録
8. FACTORS AFFECTING METAL/POLYMER INTERFACE DURABILITY IN MICROELECTRONICS PACKAGING: CHEMISTRY AND WATER UPTAKE
Clearfield, H. M. ; Furman, B. K. ; Callegari, A. ; Graham, T. ; Purushothaman, S.
出版情報: Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.321-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 323