Direct Wafer Bonding and Thinning Down: A Generic Technology to Perform New Structures

Direct Wafer Bonding and Thinning Down: A Generic Technology to Perform New Structures

著者名:

掲載資料名:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2005-02

発行年:

2005

開始ページ:

64

終了ページ:

77

総ページ数:

14

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774604 [1566774608]

言語:

英語

請求記号:

E23400/200502

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015387
シリーズID:	PA00000028
会議名:	International Symposium on Semiconductor Wafer Bonding
回次:	8th
会議開催地:	Quebec City, Canada
会議開催年:	2005.05.15-2005.05.20

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