1.

国際会議録
国際会議録
1. Current and Future Three-Dimensional LSI Integration Technology by
Manabu Bonkohara ; Makoto Motoyoshi ; Kazutoshi Kamibayashi ; Mitsumasa Koyanagi
出版情報: Enabling technologies for 3-D integration : symposium held November 27-29, 2006, Boston, Massachusetts, U.S.A..  pp.35-48,  2007.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 970
2.

国際会議録
国際会議録
2. Current and Future 3D-LSI Technology for the Image Sensor Devices
Makoto Motoyoshi ; Hirofumi Nakamura ; Manabu Bonkohara ; Mitsumasa Koyanagi
出版情報: Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A..  pp.25-32,  2009.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 1112
3.

国際会議録
国際会議録
3. Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking
Takafumi Fukushima ; Tetsu Tanaka ; Mitsumasa Koyanagi
出版情報: Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A..  pp.121-132,  2009.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 1112