Applications of Bonding SOI Technology to High Performance LSI Circuits

Applications of Bonding SOI Technology to High Performance LSI Circuits

著者名:

掲載資料名:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2005-02

発行年:

2005

開始ページ:

9

終了ページ:

19

総ページ数:

11

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774604 [1566774608]

言語:

英語

請求記号:

E23400/200502

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00015387
シリーズID:	PA00000028
会議名:	International Symposium on Semiconductor Wafer Bonding
回次:	8th
会議開催地:	Quebec City, Canada
会議開催年:	2005.05.15-2005.05.20

類似資料:

1 国際会議録 STRAINED-SOI (SSOI) AND MOBILITY ENHANCEMENT TECHNOLOGIES FOR HIGH PERFORMANCE MOSFETS IN 45NM-NODE AND BELOW YOSHIM, MAKOTO, CAYREFOURCQ, IAN, MAZURE, CARLOS Electrochemical Society	7 国際会議録 Smart Cut Technology: the path for advanced SOI substrates Moriceau, H., Lagahe-Blanchard, C., Fournel, F., Pocas, S., Jalaguier, E., Perreau, P., Deguet, C., Ernst, T., Beaumont, … Kluwer Academic Publishers
2 国際会議録 Mobility enhancement through substrate engineering Invited Cayrefourcq, I., Kennard, M., Metral, F., Mazure, C., Thean, A., Sadaka, M., White, T., Nguyen, B.Y. Electrochemical Society	8 国際会議録 Germanium-on-Insulator (GeOI) Structure Realized by the Smart CutTM Technology Letertre, F., Deguet, C., Richtarch, C., Faure, B., Hartmann, J.M., Chieu, F., Beaumont, A., Dechamp, J., Morales, C., … Materials Research Society
3 国際会議録 Thin film transfer by Smart Cut technology beyond SOI Mazure, C. Electrochemical Society	9 国際会議録 Is SOI CMOS a promising technology for SOCs in high frequency range? Invited Raynaud, C., Gianesello, F., Tinella, C., Flatresse, P., Gwoziecki, R., Touret, P., Avenier, G., Haendler, S., Gonnard, … Electrochemical Society
4 国際会議録 Intrinsic Advantages of SOI Multiple-Gate MOSFET (MuGFET) for Low Power Applications W. W. Xiong, C. Cleavelin, C. Hsu, M. Ma, K. Schruefer, K. Von Arnim, T. Schulz, I. Cayrefourcq, C. Mazure, P. Patruno, … Electrochemical Society	10 国際会議録 An Overview of FeRAM Technology for High Density Applications Dehm, C., Schindler, G., Hartner, W., Bergmann, R., Hasler, B., Kasko, I., Kastner, M., Schiele, M., Weinrich, V., … Electrochemical Society
5 国際会議録 Current Status and Future Direction of SOI Technology Yoshimi, M. Electrochemical Society	11 国際会議録 Advantages of SOI technology in low-voltage ULSIs (Invited Paper) Yoshimi,M., Kawanaka,S., Yamada,T., Terauchi,M., Shino,T., Fuse,T., Oowaki,Y., Watanabe,S. SPIE-The International Society for Optical Engineering
6 国際会議録 Wafer Bonding: a Flexible Way to Manufacture SOI Materials for High Performance Applications (Invited) Bengtsson, S., Amirfeiz, P., Johansson, M. Electrochemical Society	12 国際会議録 High performance SOI technology for sub-45nm gate length CMOS manufacturing Invited Horstmann, M., Greenlaw, D., Huebler, P., Stephan, R., Feudel, Th., Wei, A., Frohberg, K., Hoentschel, J., Javorka, P., … Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12