Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J. ; Lu, J-Q.
出版情報:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.405-415, 2003. Pennington, N.J.. Electrochemical Society
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K-W. ; Craft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraum, E. ; Cale, T.S. ; Gutmann, R.J.
出版情報:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.381-389, 2003. Pennington, N.J.. Electrochemical Society
Lu, J.-Q. ; Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J.
出版情報:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.76-86, 2003. Pennington, NJ. Electrochemical Society
PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, Chin. pp.145-148, 2005. Uetikon-Zuerich. Trans Tech Publications
Heo, Young-Woo ; Kang, B. S. ; Tien, L. C. ; Kwon, Y. ; La-Roche, J. R. ; Gila, B. P. ; Ren, F. ; Pearton, S. J. ; Norton, D. P.
出版情報:
Progress in compound semiconductor materials -- electronic and optoelectronic applications. pp.327-332, 2004. Warrendale, Pa.. Materials Research Society
Jindal, A. ; Lu, J. -Q. ; Kwon, Y. ; Rajagopalan, G. ; McMahon, J. J. ; Zeng, A. Y. ; Flesher, H. K. ; Cale, T. S. ; Gutmann, R. J.
出版情報:
Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.. pp.21-26, 2003. Warrendale, Pa.. Materials Research Society
Kwon, Y. ; Jindal, A. ; McMahon, J. J. ; Lu, J. -Q. ; Gutmann, R. J. ; Cale, T. S.
出版情報:
Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.. pp.27-32, 2003. Warrendale, Pa.. Materials Research Society
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J
出版情報:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.87-95, 2003. Pennington, NJ. Electrochemical Society
Lee, S. M. ; Ryu, K. ; Kwon, Y. ; Kim, J. G. ; Cho, W. S. ; Cho, N. H. ; Whang, C. M. ; Yoo, Y. C.
出版情報:
PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, Chin. pp.437-440, 2005. Uetikon-Zuerich. Trans Tech Publications
Kwon, Y. ; Lu, J.-Q. ; Gutmann, R.J. ; Kraft, R.P. ; McDonald, J. ; Cale, T.S.
出版情報:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.145-154, 2001. Pennington, NJ. Electrochemical Society