1.

国際会議録
国際会議録
1. Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball
J.O. Kim ; J.P. Jung ; J.H. Lee ; J. Suh ; H.S. Kang
出版情報: Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea.  pp.191-196,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 580-582
2.

国際会議録
国際会議録
2. Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM
K.I. Kang ; J.P. Jung ; W.H. Bang ; J.H. Park ; K.H. Oh
出版情報: Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea.  pp.177-182,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 580-582