Blank Cover Image

Interfacial Fluid Pressure and Its Effects on SiO2 Chemical Mechanical Polishing

著者名:
Zhou, C.
Shan, L.
Hight, J.R.
Ng, S.H.
Paszkowski, A.J.
Tichy, J.
Danyluk, S.
さらに 2 件
掲載資料名:
Chemical mechanical polishing 2000 -- fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
613
発行年:
2001
開始ページ:
E7.1
出版情報:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995215 [1558995218]
言語:
英語
請求記号:
M23500/613
資料種別:
国際会議録

類似資料:

1 国際会議録 Effects of Nano-scale Colloidal Abrasive Particle Size on SiO2 by Chemical Mechanical Polishing

Zhou, Chunhong, Shan, Lei, Ng, S.H., Hight, Robert, Paszkowski, Andrew J., Danyluk, S.

Materials Research Society
7 国際会議録 The Characteristic of Abrasive Particle in Chemical - Mechanical Polishing

Tsai, H.J., Chang, C.C., Jeng, Y.R., Chen, S.L.

Trans Tech Publications
2 国際会議録 Interfacial Pressure Measurements at Chemical-Mechanical Polishing Interfaces

Danyluk, S., Levert, J., Shan, L.

Materials Research Society
8 国際会議録 The effects of interfacial SiO2 on Pd2Si formation

Scott, D. M., Lau, S. S., Pfeffer, R. L., Lux, R. A., Mikkelson, J., Wielu-ski, L., Nicolet, M.-A.

North-Holland
3 テクニカルペーパー Nanoparticulate and Interfacial Mechanics in Confined Geometries Typical of Chemical-mechanical Planarization.

Ng, S. H., Zettner, C. M., Zhou, C., Yoon, I. -H., Danyluk, S.

American Society of Mechanical Engineers
9 国際会議録 CHARACTERIZATION OF CHEMICAL-MECHANICAL POLISHING DIELECTRICS FOR MULTILEVEL METALLIZATION

Sun, S. C., Yeh, F. L., Tien, H. Z.

MRS - Materials Research Society
4 国際会議録 Mechanical Modeling of the 2D Interfacial Slurry Pressure in CMP

Higgs III, C. Fred, Ng, Sum Huan, Yoon, Inho, Shan, Lei, Yap, Lipkong, Danyluk, Steven

Materials Research Society
10 国際会議録 Chemical Mechanical Polishing of Epitaxial Germanium on SiO2-patterned Si(001) Substrates

J.M. Hydrick, J. Park, J. Bai, C. Major, M. Curtin

Electrochemical Society
5 国際会議録 Magnetorheological fluid template for basic studies of mechanical-chemical effects during polishing

C. Miao, K. M. Bristol, A. E. Marino, S. N. Shafrir, J. E. DeGroote, S. D. Jacobs

SPIE - The International Society of Optical Engineering
11 国際会議録 Electrochemical Studies of Copper Chemical Mechanical Polishing Mechanism: Effects of Oxidizer Concentration

Lu, J., Garland, J. E., Petite, C. M., Babu, S. V., Roy, D.

Materials Research Society
6 国際会議録 Curvature-induced Wafer down Pressure Distribution and Its Influence on Chemical-Mechanical Polishing Process

Tseng, W.-T., Wang, Y.-S., Chin, J.-H., Pan, W.-C.

Electrochemical Society
12 国際会議録 Model-based control of chemical mechanical polishing

Toprac,A.J.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12