1.

国際会議録
国際会議録
1. Electromigration Failure Modes in CU Metallization*
Gall, M. ; Capasso, C. ; Thrasher, S. ; Zhao, L. ; Muiski, P. ; Hernandez, R. ; Herrick, M. ; Angyal, M. ; Boeck, B. ; Kawasaki, H.
出版情報: ULSI Process Integration : proceedings of the International Symposium.  pp.410-425,  2001.  Pennington, N.J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 2001-2
2.

国際会議録
国際会議録
2. The Electrical Integrity of Copper Plated Wafers Using a Novel Plating Bath Chemistry : Feasibility of RTA for Film Stabilization
Simpson, C.R. ; Baker, B.C. ; Herrick, M. ; Basser, P. ; Hamilton, G. ; Weitzman, E. ; Hey, P. ; Subramanyan, S. ; Chen, M. ; Shin, H. Seon ; Dordi, Y. ; Cheung, R. ; Carl, D.
出版情報: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.130-138,  1999.  Pennington, N.J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 99-31
3.

国際会議録
国際会議録
3. Advanced CVD Barrier Technology for Copper Interconnect
Jain, A. ; Adetutu, O. ; Ekstrom, B. ; Hamilton, G. ; Herrick, M. ; Venkatraman, R. ; Weitzman, E.
出版情報: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.269-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 564
4.

国際会議録
国際会議録
4. Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology
Venkatraman, R. ; Jain, A. ; Farkas, J. ; Mendonca, J. ; Hamilton, G. ; Capasso, C. ; Denning, D. ; Simpson, C. ; Rogers, B. ; Frisa, L. ; Ong, T. P. ; Herrick, M. ; Kaushik, V. ; Gregory, R. ; Apen, E. ; Angyal, M. ; Filipiak, S. ; Crabtree, P. ; Sparks, T. ; Anderson, S.
出版情報: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.41-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 514
5.

国際会議録
国際会議録
5. The Use Of The Four-Point Bending Technique For Determining The Strength Of Low K Dielectric/Barrier Interface
Tsui, T.Y. ; Glodberg, C. ; Braeckelmann, G. ; Filipiak, S. ; Ekstrom, B. ; Lee, J. ; Jackson, E. ; Herrick, M. ; Iacoponi, J. ; Martin, I. ; Sieloff, D.
出版情報: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D1.2-,  2001.  Warrendale, PA.  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 612