1.

国際会議録
国際会議録
1. Surface treatment of copper inner-layer with electrolcss copper plating using hypophosphite as a reducing agent
Honma, H. ; Hagiwara, K. ; Fujinami, T.
出版情報: Proceedings of the Second International Symposium on Electrochemical Technology Applications in Electronics.  pp.59-69,  1993.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 1993-20
2.

国際会議録
国際会議録
2. Influence of Channel Geometry on Superplasticity in Equal-Channel Angular Pressing
Kamachi, M. ; Fujinami, T. ; Horita, Z. ; Langdon, T.G.
出版情報: Superplasticity in advanced materials : ICSAM 2003 : [8th International Conference on Superplasticity in Advanced Materials, 28-30 July 2003, St. Catherine's College, Oxford, UK].  pp.477-482,  2004.  Zuerich, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 447-448