1.

国際会議録
国際会議録
1. Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder
F.J. Cheng ; H. Nishikawa ; T. Takemoto
出版情報: Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea.  pp.239-242,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 580-582
2.

国際会議録
国際会議録
2. The Effect of Square Wave AC Parameters on Weld Forming Performance
F.J. Cheng ; J.Y. Zhang ; D.P. Wang ; S.P. Wu
出版情報: Advances in materials manufacturing science and technology XIV : selected, peer reviewed papers from the 14th International Manufacturing Conference in China (IMCC2011), October 13-15, 2011, Tianjin, China.  pp.361-364,  2011.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 697-698