1.

国際会議録
国際会議録
1. The Effect of Delay Between Dry Etch and Wet Clean Processing Steps on Cleaning of Post-Etch Residues
D. Hellin ; I.J. Vos ; G. Vereecke ; E. Pavel ; W. Boullart
出版情報: Cleaning and surface conditioning technology in semiconductor device manufacturing 10.  pp.283-290,  2007.  Pennington, N.J..  Electrochemical Society
シリーズ名: ECS transactions
シリーズ巻号: 11(2)
2.

国際会議録
国際会議録
2. A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
M. O. de Beeck ; J. Versluijs ; Z. Tokei ; S. Demuynck ; J. D. Marneffe ; W. Boullart ; S. Vanhaelemeersch ; H. Zhu ; P. Cirigliano ; E. Pavel ; R. Sadjadi ; J. Kim
出版情報: Advances in resist materials and processing technology XXIV.  2007.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
シリーズ名: Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号: 6519