1.

国際会議録
国際会議録
1. TiZrN as a Copper Barrier for 0.13 μm and 0.09 μm Technology Nodes
Denning, D. ; Swedberg, L. ; Prindle, C.
出版情報: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.147-153,  2003.  Pennington, N.J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 2003-13
2.

国際会議録
国際会議録
2. Magnetic Field Configuration and Uniformity Issues in PVD Chambers
Ventzek, P.L.G. ; Hartig, M. ; Coronell, D.G. ; Arunachalam, V. ; Denning, D.
出版情報: Proceedings of the twelfth International Symposium on Plasma Processing.  pp.266-273,  1998.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 98-4
3.

国際会議録
国際会議録
3. Modeling Investigation of Plasma Clean Processes
Zhang, D. ; Denning, D.
出版情報: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.73-81,  2003.  Pennington, N.J..  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 2003-13
4.

国際会議録
国際会議録
4. CVD Cu Process Development and Integration for Sub-0.18 ｦﾌm Devices
Zhang, J. ; Denning, D. ; Braeckelmann, G. ; Hamilton, G. ; Lee, J. J. ; Venkatraman, R. ; Fiordalice, B. ; Weitzman, E.
出版情報: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.243-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 564
5.

国際会議録
国際会議録
5. Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology
Venkatraman, R. ; Jain, A. ; Farkas, J. ; Mendonca, J. ; Hamilton, G. ; Capasso, C. ; Denning, D. ; Simpson, C. ; Rogers, B. ; Frisa, L. ; Ong, T. P. ; Herrick, M. ; Kaushik, V. ; Gregory, R. ; Apen, E. ; Angyal, M. ; Filipiak, S. ; Crabtree, P. ; Sparks, T. ; Anderson, S.
出版情報: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.41-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 514
6.

国際会議録
国際会議録
6. Integration Challenges of Inorganic Low-K (K < 2.5) Materials With Cu for Sub-0.25)μm Multilevel Interconnects
Blumenthal, R. ; Braekelmann, G. ; Cave, N. G. ; Conner, J. ; Crabtree, P. ; Defilippi, J. ; Denning, D. ; Farkas, J. ; Filipiak, S. ; Fowler, B. W. ; Fox, R. ; Freeman, M. ; Garcia, S. ; Herrick, M. T. ; Hershey, R. ; Hobbs, C. C. ; Jawarani, D. ; Junker, K. ; Keyes, C. ; Kirksey, S. ; Lee, J. J. ; Lee, K. S. ; Lindell, M. ; Mora, R. ; Neil, T. ; Nguyen, T. ; Olivares, M. ; Pena, T. Newton. D. ; Selinidis, S. ; Sieloff, D. D. ; Smith, D. ; Sparks, T. ; Stankus, JJ. ; Tiwari, R. ; VanGompel, T. ; Watanabe, J. K. ; Weitzman, E. J. ; Wetzel, J. T. ; Yu, K. C. ; Zhang, J.
出版情報: Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A..  pp.151-160,  1999.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 565