1.

国際会議録
国際会議録
1. Multi-Via Electromigration Test Structures for Identification and Characterization of Different Failure Mechanisms
Choi, Z.-S. ; Chang, C.W. ; Lee, J.H. ; Gan, C.L. ; Thompson, C.V. ; Pey, K.L. ; Choi, W.K.
出版情報: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.271-276,  2005.  Warrendale, Pa..  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 863
2.

国際会議録
国際会議録
2. Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects
Choi, Z.-S. ; Gan, C.L. ; Wei, F. ; Thompson, C.V. ; Lee, J.H. ; Pey, K.L. ; Choi, W.K.
出版情報: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.373-378,  2004.  Warrendale.  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 812