1.

国際会議録
国際会議録
1. Using Wafer-Scale Patterns for CMP Analysis
Lee, B. ; Gan, T. ; Boning, D.S. ; David, J. ; Bonner, B.A. ; McKeever, P. ; Osterheld, T.H.
出版情報: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D11.8/E8.8-,  2001.  Warrendale, PA.  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 612
2.

国際会議録
国際会議録
2. Removal Rate, Uniformity and Defectivity Studies Of Chemical Mechanical Polishing of BPSG Films
Bonner, B.A. ; Fishkin, B. ; David, J. ; Garretson, C. ; Osterheld, T.H.
出版情報: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D11.6/E8.6-,  2001.  Warrendale, PA.  Materials Research Society
シリーズ名: Materials Research Society symposium proceedings
シリーズ巻号: 612